Pb-free solder paste for general mounting (reduced voiding) LFSOLDER TLF204-GT01-200

Ideal for reducing voids in bottom electrode parts, etc.

Product Features

Ideal for reducing voids in bottom electrode parts, etc.

Main Applications

Data Centers
Automotive
Car Audio
Air Conditioners
Household Appliances

Void reduction① Void observation under QFN electrode by heated X-ray observation device

By designing the ingredients so that voids are discharged from the start of solder melting (about 220°C) to the peak temperature, we have been able to significantly reduce voids compared to conventional products.

Reflow condition :Air, PCB surface treatment :Cu/OSP
Evaluation components :0.5mm pitch QFN (Sn plating)

Void reduction② Void observation under bottom electrode by X-ray observation device

Compared to conventional products, voids are significantly reduced for each components

Reflow conditions :Air, PCB surface treatments :Cu/OSP
Evaluation components :0.5mm pitch

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