Pb-free Solder Paste for General Mounting (Reduced occurrence of unfused BGA) LFSOLDER TLF-204-171AK
・Reduction of BGA unfusion
・Good wetting of lead edge surfaces
Product Features
- Reduction of BGA unfusion
- Good wetting of lead edge surfaces
Main Applications
HiP/HoP test for 0.5mm pitch BGA
Significantly reduce the occurrence rate of BGA HiP/HoP compared to conventional products
Evaluation components:0.5mm pitch BGA(85℃85%RH 24hr Heat degradation treatment, 228pins), N=4m
Comparison of wetting up for QFN Cu lead edge surface
Cu lead edge surface exposed due to insufficient wetting
Evaluation components :0.5mm pitch QFN(Cu terminals)
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