Pb-free Solder Paste for General Mounting (Halogen-free) LFSOLDER TLF-204-TNA23K/TLF-204F-TNA23K
・Halogen free
・Reduction of BGA HiP/HoP
・Suitable for through-hole reflow
Product Features
- Halogen-free
- Reduced occurrence of unfused BGAs
- Through-hole reflow compatible
Main Applications
Reduction of BGA HiP/HoP HiP/HoP test for 0.5mm pitch BGA
Both Type4 and Type5 have significantly reduced the occurrence rate of BGA
HiP/HoP compared to conventional products.
Evaluation components:0.5mm pitch BGA(85℃85%RH 24hr Heat degradation treatment, 228pins), N=4
Suitable for through-hole reflow Solder dropping test
Solder dropping occurrences rate is less than conventional product during pre-heat.
Pre-heat 150̃170℃, 100sec
Contact & Download Materials
Suitable products are proposed to meet your specific needs. Feel free to contact us for more information.
Search for Products
Search by Keywords