Low Alpha-Compatible Solder Paste
Solder paste for semiconductor bump formation.
Solder paste using fine powder with reduced alpha radiation.
Product Features
- Uses fine powder of 8µm or smaller.
- Excellent void expulsion within solder bumps.
- Good residue cleanability after reflow.
- Supports FC-BGA and FC-CSP.
- Excellent printing shape.
- Stable continuous printability.
Main Applications
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