General Solder Paste
Solder paste for semiconductor bump formation.
Solder paste using fine powder.
Product Features
- Uses fine powder of 12µm or smaller.
- Good paste release for fine patterns of 150mμm.
- Solder bump formation possible using existing equipment.
- Residues after reflow can be cleaned with pure water-based cleaning solvents.
- Excellent storage stability.
- Stable continuous printability.
Main Applications
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