DF Process Solder Paste
Solder paste for semiconductor bump formation using fine powder with reduced alpha radiation, suitable for dry film printing processes.
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Product Features
- Supports bump formation for ~60µm pitch bumps using dry film resist.
- Complies with IPC's halogen-free standards (Br,Cl content in paste ≥900ppm, total ≥1500ppm).
- Low alpha-compatible.
- Supports C4 bumps and C2 bumps.
- Reduces bump height variation.
Main Applications
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