For Micro-Bump Formation

Low Alpha-Compatible Solder Paste

Solder paste for semiconductor bump formation.
Solder paste using fine powder with reduced alpha radiation.

General Solder Paste

Solder paste for semiconductor bump formation.
Solder paste using fine powder.

NEW
DF Process Solder Paste

Solder paste for semiconductor bump formation using fine powder with reduced alpha radiation, suitable for dry film printing processes.

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Suitable products are proposed to meet your specific needs. Feel free to contact us for more information.

  • *Only 3D CAD data for the following products are available for download: Current Sensors, Gate Drivers, and Power Supply Modules.
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