Pb-Free Solder Paste for JET JDS Series
Stable dispensing with jet dispensing.
Product Features
- High-speed application without contact.
- Adjustable solder application shape and quantity.
- Supports mounting of 0603 and 0402 chips.
Main Applications
Good washability
For jet-dispensing
Specifications
| Items | TLF-204F-JD10HF | Test method |
|---|---|---|
| Solder Alloy | SAC305 | - |
| Particle size (μm) | 10- 25 | Laser scattering method |
| Flux contents (%) | 16-18wt | JIS Z 3284 (1994) |
| Viscocity(@25deg.C) (Pa.s) | 20-35 | E-type viscometer |
| Nozzle size (mmΦ) | ≧0.25 | - |
| Halogen/Halogen-free | Halogen-free | IEC 61249-2-21 |
Jet Dispenser : E-STAR, Nordson EFD
Solder paste for JET-DISPENSING
Under Development
Features
- For 3D mounted substrate
- Stencil-less process
- Compatible with 3D-MID
- Good workability (Defect reduction)
- For additional solder with non-contact
- *Jet dispensing is one of the methods of paste application to PCB with non-contact
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