Low Alpha-Compatible Pre-Coating Solder Paste
Solder paste with excellent wetting spreadability for BGA pads on semiconductor package substrates, with reduced alpha radiation.
Product Features
- Uses fine powder of 12µm or smaller.
- Excellent wettability during solder pre-coating, forming a uniform solder pre-coat.
- Complies with IPC's halogen-free standards (Br,Cl content in paste ≥900ppm, total ≥1500ppm).
- Low alpha-compatible.
- Supports screen printing.
- Residues after reflow can be cleaned with semi-water-based cleaning solvents.
Main Applications
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