General Pre-Coating Solder Paste

Solder paste with excellent wetting spreadability for BGA pads on semiconductor package substrates.

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Product Features

  • Uses fine powder of 12µm or smaller.
  • Excellent wettability during solder pre-coating, forming a uniform solder pre-coat.
  • Complies with IPC's halogen-free standards (Br,Cl content in paste ≥900ppm, total ≥1500ppm).
  • Supports screen printing.
  • Residues after reflow can be cleaned with semi-water-based cleaning solvents.

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