REFLOW OVEN TNV-MINI SERIES
This Reflow soldering system is responsible for thesoldering process (heating and cooling) of solder paste in SMT (surface mount technology).
It is a compact reflow device with a total length of 3m and 8 heating zones.
Although it is space-saving, the precise temperature settings of the 8 zones allow for a variety of Temperature profile conditions.
Product Features
- COMPACT SIZE
- include 8 heating zone in 3m length
- 250mm width substrate compatible Space-saving machine
- Temperature profiles that could not be obtained before can now be obtain as you wish
- Compact and High performance
- Can be select from "P Panel" and "X Panel"
Main Applications
Specification
| TNV25-308EM | |
|---|---|
| Number of heating zone | 8 |
| Applicable boards | MAX. W250 × L330 (mm) M I N. W 50 × L 50 (mm) |
| Component height | Upper 10, 15, 20, 25, 30mm Lower 10, 15, 20, 25, 30mm |
| Boad placement allowance | 4mm |
| N2 gas supply | 99.99% minimum 0.4～0.7Mpa 250NL/min minimum |
| Conveyor height from floor (pass line) | 900±20mm |
| Power source | AC200V-50/60Hz-3φ 27kVA 78A (In multi-grouping flip-frop specification) |
| Device dimensions | W1310×L3060 *1×H1374 *2 (mm) |
| Weights | approx. 1700kg |
| Conveyor speed | 0.3～1.5 m/min |
- *Please note that specifications are subject to change without notice.Thank you for your understanding.
- *1Exclude outlet sprocket
- *2Exclude Exhaust duct, signal tower, monitor
All kinds of other size variations are available
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