REFLOW OVEN TNR15 SERIES

This Reflow soldering sytem is responsible for the soldering process (heating and cooling) of solder paste in SMT (Surface mount technology).
Smallest ultra-compact reflow soldering machine at 2.2m in size in industry's. Because of Space-saving equipment,
it is also widely used for device production and prototype evaluation.

Product Features

  • Ultra compact size long-selling reflow oven

Main Applications

Standard function/Option

Standard function

  • Touch panel control
  • Activated carbon regenerative unit
  • Flux collection unit
  • PCB jamming alarm
  • Fan inverter individually control

Option

  • Uninterruptible Power Supply (UPS)
  • Water chiller unit
  • Oxygen density controller
  • P.C.B. carrying-out handle
  • Heater broken alarm
  • Area sensor

Specification

TNR15-225LH
Applicable boardsMAX. W150 × L150 (mm)
M I N. W 50 × L 50 (mm)
Component heightUpper 10, 15, 20, 25, 30mm
Lower 10, 15, 20, 25, 30mm
Boad placement allowance3mm
N2 gas supply99.99% minimum 0.4~0.7Mpa
150NL/min minimum
Conveyor height from floor (pass line)900±20mm
Power sourceAC200V-50/60Hz-3φ 21kVA 61A
(In synchronized specification)
Device dimensionsW1210×L2200*1×H1370*2 (mm)
Weightsapprox. 600kg
Conveyor speed0.1~0.7 m/min
  • *Please note that specifications are subject to change without notice.Thank you for your understanding.
  1. *1Exclude outlet sprocket
  2. *2Exclude Exhaust duct, signal tower, monitor

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