OSP for Gold-plated Mixed Printed Circuit Boards WPF-21TS
Excellent resistance to high temperature under air reflow condition
Product Features
- Excellent heat and humidity resistance：OSP(Organic Solderability Preservatives)
- Cost reduction from metal plating
- Applicable to lead-free
⇒ RoHS compliant - Dewetting reduction after high temperature reflow
- Quality improvement
⇒ Excellent through-hole solderbility
(2.4 ㎜t PCB 2-time reflow : Tamura test board) - Applicable to gold-plating mixed circuit boads
Main Applications
2.4mmt Cross-sectional photograph after through-hole soldering
Through-hole solderability (Multilayer Substrates 2.4mmt, 1.0mmΦ)
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