Organic Solderability Preservative（OSP） SOLDERITE WPF-207
OSP with excellent heat resistance for copper and gold mixed PWB
Product Features
- Good film-forming properties on micro-lands make it ideal for processing semiconductor package substrates.
- Prevents discoloration of gold-plated parts
- Good compatibility with flux, and good solder wetting and spreading properties.
Main Applications
Prevention of gold plating discoloration
Film condition
Solder Wettability
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