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- TLF-801-17 In-type low melting point solder paste
Solder Paste for Multiple ApplicationTLF-801-17 In-type low melting point solder paste
Excellent wettability and printability ！
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Excellent wettability to QFP lead -
Printability of 0.4mm pitch
Features
- Good solderability/wettability
- Less solder balls
- Excellent printability
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Specifications
| ITEM | TLF-801-17 | TLF-401-11 | Test method |
|---|---|---|---|
| Alloy Composition | Sn / 3.5Ag / 0.5Bi / 8.0In | Sn / 58Bi | JIS Z 3282 (1999) |
| Melting Point (°C) | 195～209 | 139 | DSC measurement |
| Particle Size of Solder Powder (μm) | 20～41 | 25～45 | Laser analysis |
| Flux Content (%) | 11.5 | 9.5 | JIS Z 3284 (1994) |
| Chlorine Content (%) | 0.24 | 0.0 | JIS Z 3197 (1999) |
| Viscosity (Pa.s) | 220 | 210 | JIS Z 3284 (1994) |
| Thixotropy Index | 0.58 | 0.59 | JIS Z 3284 (1994) |
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