Medium Melting Point Pb-Free Solder Paste In-based 801 Series
Suitable for components with low heat resistance (Melting point: 209°C).
Product Features
- Reflow peak temperature of 220°C allows for profile creation in the medium temperature range.
- Excellent wettability and solderability.
- Minimal generation of solder balls.
- Excellent printability.
Main Applications
Specifications
| Item | TLF-801-17 | Test method |
|---|---|---|
| Alloy Composition | Sn / 3.5Ag / 0.5Bi / 8.0In | JIS Z 3282 (1999) |
| Melting Point (°C) | 195～209 | DSC measurement |
| Particle Size of Solder Powder (μm) | 20～41 | Laser analysis |
| Flux Content (%) | 11.5 | JIS Z 3284 (1994) |
| Chlorine Content (%) | 0.24 | JIS Z 3197 (1999) |
| Viscosity (Pa.s) | 220 | JIS Z 3284 (1994) |
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