Pb-free Solder Paste for Micro Component Mounting (Type6) LFSOLDER TLF-204G-HFW
For stencil printing on fine patterns
Product Features
- Flux residue can be cleaned with quasi-aqueous cleaning agents
- Nitrogen reflow only
Main Applications
Stable printing at 0201 (metric) pads by using Type 6 particles
Stencil opening : 100×80um
Number of sheets of print : 10 sheets
Total number of patterns : 15220
Good solderability Suppress solder ball occurrence
Desiccation improvement succeeded to maintain its tackiness for long time
Excellent flux residue washability
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