Pb-Free Solder Paste for Local Heating LSM Series
Good solderability and solder ball suppression
Product Features
- Good solderability and less solder ball occurrence
- Stable continuous dispensing performance
Main Applications
Good solderability and less solder ball occurrence
Local soldering condition
| Evaluation area | 0.4 mmφ Cu pad |
|---|---|
| Laser apparatus | MLS-808FS Apollo Seiko Ltd. |
| Wave length | 808 nm |
| Radiation diameter | 667 μm |
Stable continuous dispensing performance
Stable dot shape even after 30,000 shots
| Dispenser | Musashi Engineering, Inc. |
|---|---|
| Nozzle inside diameter | Φ0.30mm (Precision nozzle) |
| Clearance | 0.30mm |
| Application time | 1.00mg/shot |
| Applied amount | 0.50 sec |
| Test condition | 25± 3℃ |
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