Solder Sheet for Power Semiconductors
For power semiconductor applications in EVs and industrial equipment.
Product Features
- Bonding of DBC substrates and heat sinks.
- Achieving low void formation using a vacuum reduction furnace.
- Pressure-free bonding possible.
- Bonding of next-generation power devices such as SiC, GaN, Ga₂O₃, which operate at high temperatures.
Main Applications
Contact & Download Materials
Suitable products are proposed to meet your specific needs. Feel free to contact us for more information.
Search for Products
Search by Keywords