Photosensitive Coverlay (Black Matte)

Cures with ultraviolet light! A new era coverlay that balances processability and durability.
Environmental impact reduction + improved production efficiency = the choice of photosensitive coverlay.
Ideal for mobile applications, enabling miniaturization of modules, ultra-thin, ultra-small, and highly precise designs.

Product Features

  • For Display
  • For 5G/6G communication, Weighing and multifunctionalization of CASE electronic boards
  • For Wearable, Mobile
  • For Healthcare, Medical equipment, Industrial Equipment, Automotive
  • For Datacenter

Main Applications

Specifications

itemsEvaluation conditionTPL-800-21BKM-30
TypeFilm stractureFilm(Single-layer)
Thickness-30μm
AppearanceVisual inspectionBlack matte
Exposure doseLamp DI , mJ/cm 2100 (ST 6 )
Pencil hardnessJIS K54002-3H
Adhesion after post-curingkapton100H(25μm)100/100
FCCLCu12/PI25) on Cu side100/100
Warpagekapton100H(25μm) 20×25mm2~3mm
Bending(Flexibility):MIT testRadius=0.38mm, 135°, 175cpm, 4.9N Load、
FCCL: RA L/S=100/100 (single side)
150 - 200 times
Mechanical strengthBraking Strength (MPa)20 – 30
Elongation (%)50 – 60
Elastic modulus (GPa)0.7 - 1.0
ENIG resistanceNi:6μm Au:0.05μmNo peeling
Hot Bar resistance320℃ 8sec, Flux OM338, every time apply (0.010mg/dot)20 times over
Flux resistance(Flux pool)Flux OM340, Height 0.15mm,260℃ peak Reflow(CZ 1.0μm)PASS
B HAST110℃-85% 32V 24h L/S=30μm/30μm>1.0E+8Ω
HHBT with EMI shield filmEMI Shield Film, L/S=25/25, 85deg.C85%RH,
After 100V,96h and 50V,404h, >1.0+06Ω
Clear
On Cu 20-25μmt
Flame retardancyUL94 standardVTM-0

Process flow

Example: Mobile, Wearables, Smartphones

  • Miniaturization of B2B connectors.

例:ディスプレー市場(For Display)

  • 優れた平滑性
  • 高解像micro LED chip 実装
  • 高い隠蔽性

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