AIR FLOW Soldering System HC-L SERIES
Chamber-less air-compatible flow equipment for DIP soldering process.
Product Features
- Hot air blow heating WAVE soldering system
- Completely Lead-free soldering, high precision preheat.
- Spot cooler is standard to be attached for optimum soldering!! Optimum soldering has been realized.
- Secondary nozzle former remote adjustable mechanism Remote control with Lap top PC. (Option)
- Central control with touch panel
- Automatic adjustment of preheating temperature of the printed circuit board.
- Reduce solder dross with local N2 hood(KL-Series)
Main Applications
Specification
| HC33-32LX/LT | HC40-32LX/LT | |
|---|---|---|
| Applicable boards | MAX W330×L350×t1.6 (mm) M I N W 50×L120×t0.6 (mm) | MAX W400×L450×t1.6 (mm) M I N W 50×L120×t0.6 (mm) |
| Component height | Upper 150mm or less Lower 6mm or less | Upper 150mm or less Lower 6mm or less |
| Power source | AC200V±10% -50/60Hz-3φ 34kVA 97A | AC200V±10% -50/60Hz-3φ 34kVA 97A |
| Conveyor angle | 4 ~ 5°(Standard 4.5°) | 4 ~ 5°(Standard 4.5°) |
| Dimensions | W1320×L3200×H1630 (mm) | W1390×L3200×H1630 (mm) |
| Weight | Approx. 1500kg | Approx. 1500kg |
| Solder bath capacity(Sn100%) | Approx. 490kg | Approx. 490kg |
- *Please note that specifications are subject to change without notice.Thank you for your understanding.
Catalog download
Contact & Download Materials
Suitable products are proposed to meet your specific needs. Feel free to contact us for more information.
Search for Products
Search by Keywords