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- TLF-401-11 Bi-type low melting point solder paste
Solder Paste for Multiple ApplicationTLF-401-11 Bi-type low melting point solder paste
For low-temperature reflow profile！
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Printability at 0.4mm pitch
Features
- For low-temperature air reflow
- Stable printability with continuous printing
- Good solderability to various components
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
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