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- TLF-204-75 Cleanable No-Clean Solder Paste
Solder Paste for Multiple ApplicationTLF-204-75 Cleanable No-Clean Solder Paste
Excellent cleanability!
-
After reflow -
Cleaning with hydrocarbon-based detergent
Features
- Flux residue can easlily be removed using hydrocarbon-base or semi-aqueous detergents
- Good solderablity with fine pitch components: 0.4mmP QFP
- Good solderbility/ wettability to various components
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Specifications
| ITEM | TLF-204-NH | Test method |
|---|---|---|
| Alloy Composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282 (1999) |
| Melting Point (°C) | 216～220 | DSC measurement |
| Particle Size of Solder Powder (μm) | 20～38 | Laser analysis |
| Flux Content (%) | 11.2 | JIS Z 3284 (1994) |
| Chlorine Content (%) | 0 | JIS Z 3197 (1999) |
| Viscosity (Pa.s) | 200 | JIS Z 3284 (1994) |
| Thixotropy Index | 0.58 | JIS Z 3284 (1994) |
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