Oct. 21, 2026

A subsidiary of Tamura Corporation (Headquarters: Nerima-ku, Tokyo; President and COO: Mitsutaka Nakamura) will be exhibiting at NEPCON ASIA, a forefront of Manufacturing and Electronics Tradeshows, held from October 27 to 29, 2026, at Shenzhen in China.

“NEPCON ASIA” is one of Asia’s leading comprehensive exhibitions, bringing together a wide range of advanced technologies for electronics manufacturing, including electronics assembly, semiconductor packaging, optical communication modules, and smart factories. At the TAMURA booth, we will showcase a broad range of material solutions designed to meet diverse electronics assembly needs. These include the “NOCTURNE^TM” series of black solder resists, which brings a fresh new look to conventional printed circuit board assembly, as well as solder pastes, solder resists, carbon pastes, and OSP engineered to meet the performance requirements of advanced applications such as AI servers and high-speed communications.

【Exhibited Products】

Black Solder resist "NOCTURNE^TM"

Based on the concept of "A black tailored for high-end applications," the "NOCTURNE^TM" series delivers a sophisticated impression, highlights manufacturing precision, and expands design possibilities. It achieves high levels of heat resistance, reliability, resolution, and mounting stability, making it ideal for high-end applications.