Nov. 28, 2025

Tamura Corporation (Headquarters: Nerima-ku, Tokyo; President and COO: Mitsutaka Nakamura; hereinafter referred to as "the Company") announces that a research paper presented by a researcher from the Company’s Sendai Advanced Laboratory has received the Best Paper Award at the IEEE CPMT Symposium Japan (hereinafter “ICSJ2025”) (Note 1).

The award-winning paper, titled “Research on low thermal resistance/high reliability technology for ultra-compact double-sided cooled SiC power modules,” was primarily authored by a researcher from the Sendai Advanced Laboratory. It summarizes the results of a project conducted under the Ministry of Education, Culture, Sports, Science and Technology (MEXT) program for Innovative Power Electronics Platform Technology Development, promoted by Tohoku University (Note 2). The paper was presented at ICSJ2025, held in Kyoto from November 12 to 14, 2025, and was highly evaluated for its research on low thermal resistance and high reliability, earning the Best Paper Award.
The Sendai Advanced Laboratory is engaged in collaborative research with Tohoku University to develop differentiated magnetic passive components and power module insulation materials from the material level, aiming for high efficiency, high power, and high-frequency operation compatible with wide bandgap (WBG) semiconductors. For the insulation part of the power module presented in this paper, Tamura supplied its proprietary insulation film.

Under the 14th Medium-Term Management Plan, “One TAMURA for Next 100”, the Company positions the clean energy market as a key focus area. Aiming to realize a carbon-neutral society, the Company takes this award as an encouragement to continue striving to establish a solid technological foundation that will support Tamura’s next 100 years and to create new pillars of business.