Nov. 07, 2025

Tamura Corporation (Headquarters: Nerima-ku, Tokyo; President and COO: Mitsutaka Nakamura; hereinafter referred to as "the Company") announces that its proprietary Photo Imageable Coverlay Coat ("PICC") has been adopted for use in AI servers, marking an expansion of the Company’s product offerings for data center applications.

PICC＝Photo Imageable Coverlay Coat

PICC is a multifunctional material that integrates coverlay and solder resist capabilities, offering superior performance in high-density component mounting and low rebound characteristics. It is particularly suited for advanced flexible printed circuit boards requiring miniaturization, high functionality, and thin profiles. Since the second half of FY2024, PICC has steadily built a track record of sales.
Driven by increasing demand for AI infrastructure, PICC sales have accelerated since the second half of FY2025 following its adoption in AI servers. The Company aims to further expand PICC’s applications to next-generation communication devices, including AI-enabled smartphones, wearable devices, and software-defined vehicle (SDV) displays. The Company targets a threefold increase in PICC sales by FY2027 compared to FY2024.

The Company provides a comprehensive portfolio of products ranging from materials to equipment. In the data center domain, its offerings include PICC, solder paste, solder resist, large transformers for power distribution units (PDUs), large reactors for uninterruptible power supplies (UPS), gate driver modules, and current sensors—all of which have been adopted in various systems.
The Company is committed to delivering total solutions through its diverse product portfolio and will continue to grow in tandem with the expanding data center market. Under its 14th Medium-term Management Plan, “One TAMURA for Next 100,” the Company is committed to achieving key financial targets by FY2027, including a return on equity (ROE) of 8% or higher and an operating profit margin of 7% or higher.