Solder Paste for Multiple ApplicationTLF-204W-13 Water cleanable Solder Paste

Water-soluble flux residue!

  • TLF-204W-13 洗浄後(50℃/5分間シャワー洗浄)
    After(50℃/5minute)

Features

  • Flux residue removable by water cleaning after high-temperature reflow
  • Good solderability compatible with 0.4mm-pitch CSP and other fine patterns
  • Good solderability compatible with both nitrogen and air reflow

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

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