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- TLF-204-NH Halogen-Free Solder Paste
Solder Paste for Multiple ApplicationTLF-204-NH Halogen-Free Solder Paste
Excellent wettability and heat resistance!
-
Wetting of QFP lead ends（N2 Reflow） -
Wetting of QFP lead ends（Air Reflow）
Features
- Halogen compounds are not intentionally added
- Stable printability with continuous printing
- Good solderability in air reflow
- Suitable with conventional lead-free standard reflow profile
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Specifications
| 項目 | TLF-204-NH | Test method |
|---|---|---|
| Alloy Composition | Sn/3.0Ag/0.5Cu | JIS Z 3282 (1999) |
| Melting Point (°C) | 216～220 | DSC measurement |
| Particle Size of Solder Powder (μm) | 25～41 | Laser analysis |
| Flux Content (%) | 12 | JIS Z 3284 (1994) |
| Chlorine Content (%) | 0 | JIS Z 3197 (1999) |
| Viscosity (Pa.s) | 210 | JIS Z 3284 (1994) |
| Thixotropy Index | 0.55 | JIS Z 3284 (1994) |
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