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- TLF-204-MDS Series Solder Paste for BGA Head -on-Pillow Reduction
Solder Paste for Multiple ApplicationTLF-204-MDS Series Solder Paste for BGA Head -on-Pillow Reduction
Excellent Wettability on BGA!
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Excellent Wettability on BGA
Features
- Head-on-Pillow reduction
- Heat resisntance to high pre-heating temperature
- Void reduction
- Solderability at small lands
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Specifications
| ITEM | TLF-204-MDS | TLF-204-MDS2 | TLF-204-MDS3 |
|---|---|---|---|
| Alloy Composition | Sn/3.0Ag/0.5Cu | Sn/3.0Ag/0.5Cu | Sn/3.0Ag/0.5Cu |
| Melting Point (°C) | 216～220 | 216～220 | 216～220 |
| Particle Size of Solder Powder (μm) | 25～41 | 20～36 | 25～41 |
| Flux Content (%) | 10.9 | 11 | 11 |
| Chlorine Content (%) | 0 | 0 | 0 |
| Viscosity (Pa.s) | 195 | 195 | 195 |
| Thixotropy Index | 0.55 | 0.57 | 0.55 |
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