Solder Paste for Multiple ApplicationTLF-204-MDS Series Solder Paste for BGA Head -on-Pillow Reduction

Excellent Wettability on BGA!

  • TLF-204-MDSSeries ボイド・BGA不ぬれ対応ソルダーペースト
    Excellent Wettability on BGA

Features

  • Head-on-Pillow reduction
  • Heat resisntance to high pre-heating temperature
  • Void reduction
  • Solderability at small lands

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

Specifications

ITEM TLF-204-MDS TLF-204-MDS2 TLF-204-MDS3
Alloy Composition Sn/3.0Ag/0.5Cu Sn/3.0Ag/0.5Cu Sn/3.0Ag/0.5Cu
Melting Point (°C) 216~220 216~220 216~220
Particle Size of Solder Powder (μm) 25~41 20~36 25~41
Flux Content (%) 10.9 11 11
Chlorine Content (%) 0 0 0
Viscosity (Pa.s) 195 195 195
Thixotropy Index 0.55 0.57 0.55
TOP