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- TLF-204-19ACα High reliability Solder paste for narrow pitch assembling
High Reliability Lead-free Solder PasteTLF-204-19ACα High reliability Solder paste for narrow pitch assembling
Narrow pitch assembles! Bonding reliability ensures! Insulation reliability improved!
Features
- We improved shape retention on heating process by controlling viscosity reduction on pre-heating process
- We improved wettability than rosin paste due to optimize flux combination
- Improved migration resistance by controlling flux-residue clacking
Application
- Wind/Solar power generation
- Household appliances
- Automotive
- Chip component
- Industrial machinery
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