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- TLF-204-189 Solder paste for void and flux scattering reduction
Solder Paste for Multiple ApplicationTLF-204-189 Solder paste for void and flux scattering reduction
Void/ flux scattering reduction！
Features
- Void reduction
- Less flux scattering
- Low flux residues
- Printability improved
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
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