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- TLF-204-171 Series Solder paste for fine-pitch/ high speed printing
Solder Paste for Multiple ApplicationTLF-204-171 Series Solder paste for fine-pitch/ high speed printing
For fine-pitch printing！
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Test condition
Stencil thickness:100μm
Opening:0.24mmφ
Features
- Stable printability
- Compatible with various components
- Void reduction
- Good results at ICT
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Catalog Download
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