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- RMA-785-13H Low flux residue solder paste for N2 reflow
Solder Paste for Multiple ApplicationRMA-785-13H Low flux residue solder paste for N2 reflow
Improved results at ICT！
-
Conventional -
RMA-785-13H
Features
- Low flux residues (good results at ICT)
- Less flux scattering
- Applicable to vacuum reflow
- Excellent electrical reliability
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Specifications
| Item |
RMA-785-13H | Test method |
|---|---|---|
| Particle Size of Solder Powder (μm) | Type4 (20～45μm) | Laser analysis |
| IPC Flux Classificaiton |
ROL1 | DSC measurement |
| Chlorine Content (%) | 0%（Halogen consisted） | Potentiometric titration （Measured flux only） |
| Viscosity (Pa.s) | 200 | JIS Z 3284 |
| Flux Content (%) | 10.5 | JIS Z 3197 |
| Reflow atmosphere | N2 (1000ppm以下) | - |
Catalog Download
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