Solder Paste for Multiple ApplicationRMA-785-13H Low flux residue solder paste for N2 reflow

Improved results at ICT!

  • 通常品
    Conventional
  • RMA-785-13H
    RMA-785-13H

Features

  • Low flux residues (good results at ICT)
  • Less flux  scattering
  • Applicable to vacuum reflow
  • Excellent electrical reliability

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

Specifications

Item
RMA-785-13H Test method 
Particle Size of Solder Powder (μm) Type4 (20~45μm) Laser analysis
IPC Flux Classificaiton
ROL1 DSC measurement
Chlorine Content (%) 0%(Halogen consisted) Potentiometric titration
(Measured flux only)
Viscosity (Pa.s) 200 JIS Z 3284
Flux Content (%) 10.5 JIS Z 3197
Reflow atmosphere N2 (1000ppm以下) -

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