Solder paste for fine pitch micro bumpingVoid reduction LF-204-GD Series　

For fine pitch support, void reduction!

ex）130µmP　Bump formation

Features

◎Developed for bump formation in semiconductor packaging

  • Manufacturing cost reduction
  • Improvement of high quality and workability:
    Less void occurrence improved higher end product quality
    Bump Height stability.

Application

  • Semiconductor package
  • Chip component

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