Solder paste for pre-soldering LF-204-351
Developed for improving joining reliability！
Features
◎Solder paste for pre-soldering for semiconductor packaging- Improve yield ratio / Quality stability
⇒Thin and uniform solder film is formed on copper pads
⇒Oxidation prevention on copper pads, prevention of copper surface deterioration by heat - Alternative to gold plating (lower cost)
Application
- Semiconductor packaging
- Chip component
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