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- LF-204-15 Solder paste for ultra-fine pitch bumping
Solder Paste for Fine Pitch BumpingLF-204-15 Solder paste for ultra-fine pitch bumping
Suitable for fine pitch bumping！
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SEM photograph of solder powder -
Printability(70μmφ)
Features
- Excellent transfer efficiency at 70μmφ printing
- Cleanable with semi-aqueous detergents
- Solder bump formation by using existing equipment
Application
- Semiconductor package
- Chip component
Specifications
| ITEM | LF-204-15 |
|---|---|
| Alloy Composition | Sn / 3.0Ag / 0.5Cu |
| Melting Point (°C) | 216～220 |
| Particle Size of Solder Powder (μm) | 1～12 |
| Flux Content (%) | 12 |
| Chlorine Content (%) | 0 |
| Viscosity (Pa.s) | 260 |
| Thixotropy Index | 0.65 |
Catalog Download
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