Solder Paste for Fine Pitch BumpingLF-204-15 Solder paste for ultra-fine pitch bumping

Suitable for fine pitch bumping!

  • LF-204-GDSeries
    SEM photograph of solder powder
  • LF-204-GDSeries
    Printability(70μmφ)

Features

  • Excellent transfer efficiency at 70μmφ printing
  • Cleanable with semi-aqueous detergents
  • Solder bump formation by using existing equipment

Application

  • Semiconductor package
  • Chip component

Specifications

ITEM LF-204-15
Alloy Composition Sn / 3.0Ag / 0.5Cu
Melting Point (°C) 216~220
Particle Size of Solder Powder (μm) 1~12
Flux Content (%) 12
Chlorine Content (%) 0
Viscosity (Pa.s) 260
Thixotropy Index 0.65
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