Low Silver Content Lead-free Solder PasteGP-213 Series Low silver content lead-free solder paste
Same workability as SAC305 solder paste. Excellent joint reliability and wettability.Recommended low silver lead-free alloy by JEITA (Japan Electronics and Information Technology Industries Association)
- Excellent wettability using newly developed activators
- Almost the same melting point as SAC305(approx. 220℃). Standard SAC305 reflow profile applicable
- Recommended alloy composition by JEITA
- ※"Halogen-free" is defined in IEC:61249-2-21 and IPC:4101 B.
Solder alloy: Sn-2.0Bi-1.0Ag-0.7Cu (second-generation reflow soldering paste, recommended composition by JEITA) is also available.
- Wind/Solar power generation
- Mobile Device
- Household appliances
- Chip component
- Industrial machinery
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