OSP (Onganic Solderability Preservative)WPF-21TS OSP for Gold-plated Mixed Printed Circuit Boards

Excellent resistance to high temperature under air reflow condition

 

Features

◎Excellent heat and humidity resistance：OSP(Organic Solderability Preservatives)

  • Cost reduction from metal plating
  • Applicable to lead-free
    ⇒ RoHS compliant
  • Dewetting reduction after high temperature reflow
  • Quality improvement
    ⇒ Excellent through-hole solderbility
    (2.4 ㎜t PCB 2-time reflow : Tamura test board)
  • Applicable to gold-plating mixed circuit boads

Application

  • Mobile device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Industrial machinery

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